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Department of MECH | REC

                1.  Samson Eilon, “Elements of Production Planning and Control”, Universal Book Corpn.1984
                2.  Elwood S.Buffa, and Rakesh K.Sarin, “Modern Production / Operations Management”, 8  Edition,
                                                                                                  th
                    John Wiley and Sons, 2000.
                3.  Kanishka Bedi, “ Production and Operations management”, 2 nd Edition, Oxford university press,
                    2007.
                4.  Melynk, Denzler, “ Operations management – A value driven approach” Irwin Mcgraw hill.
                5.  Norman Gaither, G. Frazier, “Operations Management”, 9th edition, Thomson learning IE, 2007
                6.  Jain. K.C & L.N. Aggarwal, “Production Planning Control and Industrial Management”,  Khanna
                    Publishers, 1990.
                7.  Chary. S.N. “Theory and Problems in Production & Operations Management”, Tata McGraw Hill,
                    1995.
                8.  Upendra Kachru, “Production and Operations Management – Text and cases”, 1st Edition,


                                                                                                  L  T  P  C
                  EC17E63             MICRO ELECTRO MECHANICAL SYSTEMS
                                                                                                  3   0  0   3

             OBJECTIVES:
                  To provide knowledge of semiconductors and solid mechanics to fabricate MEMS devices.
                  To introduce electrostatic and magnetic sensors and actuators
                  To introduce piezo resistive sensors and actuators
                  To introduce different materials used for MEMS
                  To educate on the applications of MEMS to disciplines beyond Electrical and Mechanical
                    engineering.



             UNIT I               INTRODUCTION                                                                   9
             Definition  of  MEMS,  MEMS  history  and  development  -  Intrinsic  Characteristics  of  MEMS  –  Energy
             Domains and Transducers- Sensors and Actuators – Introduction to Micro fabrication - Silicon based MEMS
             processes  –  New  Materials  –  Review  of  Electrical  and  Mechanical  concepts  in  MEMS  –  Semiconductor
             devices – Stress and strain analysis – Flexural beam bending- Torsional deflection.

             UNIT II              SENSORS AND ACTUATORS-I                                                              9
             Electrostatic sensors – Parallel plate capacitors – Applications – Interdigitated Finger capacitor – Comb drive
             devices – Micro Grippers – Micro Motors - Thermal Sensing and Actuation – Thermal expansion – Thermal
             couples  –  Thermal  resistors  –  Thermal  Bimorph  -  Applications  –  Magnetic  materials  for  MEMS  and
             properties  -  Magnetic  Actuators  –  Micromagnetic  components  –  Case  studies  of  MEMS  in  magnetic
             actuators- Actuation using Shape Memory Alloys

             UNIT III             SENSORS AND ACTUATORS-II                                                             9
             Piezoresistive  sensors  –  Piezoresistive  sensor  materials  -  Stress  analysis  of  mechanical  elements  –
             Applications  to  Inertia,  Pressure,  Tactile  and  Flow  sensors  –  Piezoelectric  sensors  and  actuators  –
             piezoelectric effects – piezoelectric materials – Applications to Inertia , Acoustic, Tactile and Flow sensors.

             UNIT IV       MICROMACHINING                                                                        9
             Silicon Anisotropic Etching – Anisotrophic Wet Etching – Dry Etching of Silicon – Plasma Etching – Deep
             Reaction Ion Etching (DRIE) – Isotropic Wet Etching – Gas Phase Etchants – Case studies - Basic surface
             micro machining processes – Structural and Sacrificial Materials – Acceleration of sacrificial Etch – Striction
             and Antistriction methods – LIGA Process - Assembly of 3D MEMS – Foundry process.

              UNIT V              POLYMER AND OPTICAL MEMS                                                        9





             Curriculum and Syllabus | B.E. Mechanical Engineering | R2017                             Page 96
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