Page 82 - R2017-REC-ECE-UG Syllabus

Department of ECE, REC

REFERENCES
1. R Bose, “Information Theory, Coding and Crptography”, TMH 2007
2. S Gravano, “Introduction to Error Control Codes”, Oxford University Press 2007
3. Amitabha Bhattacharya, “Digital Communication”, TMH 2006
4.Mark Nelson, “Data Compression Book”, BPB Publication 1992.
5. Watkinson J, “Compression in Video and Audio”, Focal Press, London, 1995.

EC17E63 MICRO ELECTRO MECHANICAL SYSTEMS L T P C
3 0 0 3
PREREQUISITE: Knowledge on Electronic devices, IC fabrication process and Engineering Chemistry

OBJECTIVES:
The students are able to:
• To introduce the fundamental concept of MEMS & Microsystem.
• To gain an understanding of standard micro-fabrication techniques.
• To understand the fundamental principles behind the operation of MEMS devices/systems.
• To apply knowledge of microfabrication techniques and applications to the design and manufacturing
of MEMS devices.
• To acquire knowledge in materials and appreciate the importance of microsystem packaging

UNIT I MEMS OVERVIEW 9
MEMS and microsystems, evolution of micro fabrication, microsystem and microelectronics, intrinsic
characteristics of MEMS, application of Microsystems

UNIT II MICRO SENSOR AND ACTUATORS 9
Working principles of MEMS Sensors -Acoustic wave sensors, Bio sensors, Chemical sensor, optical sensors,
Micro accelerometer, Capacitive and Piezo Resistive Pressure sensors and Thermal Sensors, Micro actuation –
thermal forces, Shape Memory alloys, Piezo electric Crystal and electrostatic forces, Applications-
Microgripper, Microvalve, Micropump, Micromotor

UNIT III MEMS MATERIAL AND PROCESSES 9
Structure of silicon and other materials, Silicon Compounds - silicon dioxide, silicon carbide, silicon nitride,
and polycrystalline silicon, Polymer for MEMS, Silicon wafer processing, Thin-film deposition- Physical
Vapor Deposition, Chemical vapor deposition, Lithography, Wet Etching and Dry Etching.

UNIT IV MICROMACHINING 9
Bulk micromachining – overview of etching, isotropic and anisotropic etching, wet etchants, etch stop, dry
etching, comparison of wet and dry etching, Surface micromachining – General description, process,
mechanical problems associated with surface micromachining, LIGA- General description, process, material
for substrate and photoresists, Electroplating, SLIGA process

UNIT V MICROSYSTEM PACKAGING 9
Overview of packaging, packaging design, selection of packaging materials, levels of microsystem packaging,
interface in microsystem packaging, essential packaging technologies, Assembly of micro systems

Curriculum and Syllabus | B.E. Electronics and Communication Engineering | R2017 Page 82