Page 83 - R2017-REC-ECE-UG Syllabus

Department of ECE, REC

TOTAL = 45 PERIODS

OUTCOMES:
As an outcome of completing this course, student will be able to
• Be introduced to the field of MEMS and micro systems.
• Understand materials for MEMS applications.
• Gain knowledge of basic approaches for micro system design.
• Understand state-of-the-art micromachining and packaging technologies.
• Have a good vision to the future of MEMS.

TEXT BOOK:
1.Tai Ran Hsu, “MEMS and Microsystems Design and Manufacture”, Tata-McGraw Hill, New Delhi, 2002

REFERENCES:
1.Mark Madou, “Fundamentals of Micro fabrication”, CRC Press, New York, 1997
2.Stephen D.Senturia, “Micro system Design”, Springer International Edition, 2011.
3.Chang Liu, “Foundations of MEMS”, Pearson, 2012.
4.NadimMaluf, KirtWillams, “An Introduction to Micro electromechanical Engineering”, Artech House

Publishers, London, 2004.

PROFESSIONAL ELECTIVE II

EC17E64 DSP ARCHITECTURE AND PROGRAMMING L T P C
3 0 0 3
PREREQUISITE: Knowledge on Digital Signal Processing

OBJECTIVES:
The student is able to:
• To study about MAC and memory access of DSP processors
• To understand addressing modes and instruction set of general purpose DSP processors
• To understand addressing modes and instruction set of VLIW DSP processors
• To acquire knowledge about programming using DSP processors
• To familiarize with the fundamentals of Advanced DSP architectures and some applications.

UNIT I FUNDAMENTALS OF PROGRAMMABLE DSPs 9
Multiplier and Multiplier accumulator – Modified Bus Structures and Memory access in PDSPs – Multiple
access memory – Multi-port memory – VLIW architecture- Pipelining – Special Addressing modes in P-DSPs
– On chip Peripherals.

Curriculum and Syllabus | B.E. Electronics and Communication Engineering | R2017 Page 83