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OPEN ELECTIVE OFFERED BY DEPT OF
ELECTRONICS AND COMMUNICATION

S. COURSE COURSE TITLE CATEGORY CONTACT L T P C
NO. CODE PERIODS
1. OEC1701 MEMS and its applications OE 3 3 0 0 3
2. OEC1702 Consumer Electronics OE 3 3 0 0 3
3. OEC1703 Digital Image Processing and OE 3 3 0 0 3
its applications
4. OEC1704 Pattern Recognition and OE 3 3 0 0 3
Artificial Intelligence
5. OEC1705 Electronics Engineering OE 3 3 0 0 3

OEC1701 MEMS and its Applications L T P C
3 0 0 3
OBJECTIVES:
This course is intended to introduce the students to

 MEMS and Micro fabrication
 Properties of MEMS materials
 Principles behind sensing and actuation using MEMS devices
 Micromachining techniques
 Polymers in MEMS and optical MEMS

UNIT I INTRODUCTION TO MICRO ELECTRO MECHANICAL SYSTEMS (MEMS)
AND MICROFABRICATION 9

History of MEMS Development, Characteristics of MEMS-miniaturization - micro electronics
integration - Mass fabrication with precision. Micro fabrication - microelectronics fabrication process-
silicon based MEMS processes

UNIT II ELECTRICAL AND MECHANICAL PROPERTIES OF MEMS MATERIALS 9

Conductivity of semiconductors, crystal plane and orientation, stress and stain – definition – relationship
between tensile stress and stain- mechanical properties of silicon and thin films, Flexural beam bending
analysis under single loading condition- Types of beam- deflection of beam-longitudinal stain under
pure bending spring constant, torsional deflection, intrinsic stress, resonance and quality factor.

UNIT III SENSING AND ACTUATION 9

Electrostatic sensing and actuation-parallel plate capacitor – Application-Inertial, pressure and tactile
sensor parallel plate actuator- comb drive. Thermal sensing and Actuations-thermal sensors-Actuators-
Applications- Inertial, Flow and Infrared sensors. Piezo resistive sensors- piezo resistive sensor material-
stress in flexural cantilever and membrane application-inertial, pressure, flow and tactile sensors.

Curriculum and Syllabus | Open Electives | R 2017 | REC Page 62