Page 102 - Module DMV20173

5. 0 JOINING PROCESSES

EXERCISE 5.2

Brazing is widely used in industries because of its many advantages.

Describe any five (5) advantages.

5.5 SOLDERING

Figure 5.11 Soldering process.

1. Soldering is a method of joining similar or dissimilar metals by means of filler metal

whose liquidus temperature is below 450°C (Figure 5.11).
2. Though soldering offers a good joint between two plates, the strength of the joint is
limited by the strength of the filler metal used.

3. Soldering normally used for obtaining a neat leak proof joint or a high conductivity
electrical joint.
4. Not suitable for high temperature service because of low temperature of filler used.
5. The filler metal enters the soldered joint is similar to brazing by means of capillary
action.

6. Soldering joint must be cleaned to provide chemically clean surfaces to obtain a
proper bond. It is generally done by using solvent cleaning, acid pickling and even
mechanical cleaning.
7. To remove the oxides form the joint surfaces and prevent oxidation, fluxes are

generally used, rosin and sorin plus alcohol based flux.
8. For mass production, soldering is an automated process called dip soldering and
wave soldering, which has been applied extensively in the electronics assembly
industry, like an electrical printed circuit board (PCB).

BPLK 134 DMV 20173