Page 88 - R2017-REC-ECE-UG Syllabus

Department of ECE, REC

unit splitting and clustering- State of the art Speech recognition application- dictation machine, voice
command driven applications, Speech –to-Speech system.

UNIT V SPEECH SYNTHESIS 9
Text-to-Speech Synthesis: Concatenative and waveform synthesis methods, sub-word units for TTS,
intelligibility and naturalness – role of prosody, Applications and present status.

TOTAL = 45 PERIODS

OUTCOMES:
Upon completion of the course, students will be able to:
• Understand speech production system and acoustic- phonetics concept of speech.
• Able to handle and process digitized speech data.
• Extract and compare different speech parameters.
• Understand and apply statistical model for Speech recognition applications.
• Understand and apply Text-to-Speech synthesis.

TEXT BOOK:
1. Lawrence Rabiner and Biing-Hwang Juang, “Fundamentals of Speech Recognition”, Pearson
Education, 2003.

REFERENCES:
1. Daniel Jurafsky and James H Martin, “Speech and Language Processing – An Introduction to
Natural Language Processing, Computational Linguistics, and Speech Recognition”, Pearson
Education
2. Steven W. Smith, “The Scientist and Engineer’s Guide to Digital Signal Processing”, California
Technical Publishing.
3. Thomas F Quatieri, “Discrete-Time Speech Signal Processing – Principles and Practice”, Pearson
Education.
4. Claudio Becchetti and LucioPrinaRicotti, “Speech Recognition”, John Wiley and Sons, 1999.
5. Ben gold and Nelson Morgan, “Speech and audio signal processing”, processing and perception of
speech and music, Wiley- India Edition, 2006 Edition.
6. Frederick Jelinek, “Statistical Methods of Speech Recognition”, MIT Press.

EC 17E68 ELECTRONICS PACKAGING AND TESTING L T P C
3 0 0 3

PREREQUISITE: Knowledge on Electron devices and Electrical and Instrumentation Engineering

OBJECTIVES:
The student is able to:
• To give a comprehensive introduction to the various packaging types used along with the associated
same the thermal, speed, signal and integrity power issues.
• To introduce about CAD used in designing wiring boards.
• To understand the basics of testing and the testing equipment’s.
• To understand the different testing methods.
• To Understand the Embedded passive technologies and testing equipment’s.

UNIT I OVERVIEW OF ELECTRONIC SYSTEMS PACKAGING AND INTRODUCTION OF
TESTING
9
Definition of a system and history of semiconductors packaging-Products and levels of packaging-Packaging
aspects of handheld products- Definition of PWB- Basics of Semiconductor and Process flowchart- Wafer
fabrication- inspection and testing- Wafer packaging- Packaging evolution- Chip connection choices- Wire

Curriculum and Syllabus | B.E. Electronics and Communication Engineering | R2017 Page 88