Page 452 - APPLIED PROCESS DESIGN FOR CHEMICAL AND PETROCHEMICAL PLANTS, Volume 1, 3rd Edition
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418                       Applied Process Design for Chemical  and Petrochemical  Plants
















                             a)  Epoxy vent
                                                                                 b) Composite vent















                         c)  Epoxy vent with support                   d) Typical  explosion vent and mounting frame
         Figure  7-SR.  Low  pressure  bursting vents for explosion  relief on  storage  silos,  buildings,  etc.  Usually burst 1.0  to  8.0  psig  depending  on
         design. Round vents also available.  By permission, Fike Metal  Products Div., Fike Corporation, Inc.




















         Figure 7-9A.  Non-metal frangible disk.  Ruptured disk showing com-
         plete breakout of membrane.  Courtesy of Falls Industries,  Inc.
                                                               Figure  7-98.  Standard  non-metal  frangible  disk  (graphite),  Teflon®
                                                               coatings or linings are available on entire disk.  By permission, Zook
                                                               Enterprises.
            The set pressure tolerances of pressure relief valves are
          not to exceed ±2 psi for pressures up to and including 70
          psig and ±3%  for pressures above 70 psig.  Indirect opera-   The  pilot valve  is  a  self-actuated  pressure  relief valve
          tion  of safety  valves,  for  example,  by  pilot  valve,  is  not   that controls the main valve opening.
          acceptable  unless  the  primary  unloading valve  will  auto-
          matically open at not over the set pressure and will oper-   Nonreclosing Pressure Relieving Devices
          ate fully in accordance with design relieving capacity con-
          ditions  if some  essential  part  of  the  pilot  or  auxiliary   Rupture  disks must have a  specified bursting pressure
          device should fail  [ 1].                            at a specified temperature. There must be complete iden-
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